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Specifications
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SAMSUNG SMT Pick and Place Machine
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Alignment
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Flying Vision+Stage Vision
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Number of Spindles
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6 Spindles x 1Gantry
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Placement Speed
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30,000 CPH(Optimum)
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Placement
Accuracy
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±40μm@μ+3σ (Based on the Standard Chips)
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Component Range
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Chip 0402 ~ 14mm(H 12mm) IC, Connector(Lead Pitch 0.4mm) BGA, CSP(Ball Pitch 0.4mm)
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Board
Dimension(mm)
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50(L) x 40(W)~510(L) x 460(W)610(L) x 460(W)(Option)
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Feeder Capacity
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120ea / 112ea(Docking Cart) (Based on 8mm)
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Power
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AC200 / 208 / 220 / 240 / 380 / 415V (50/60Hz, 3Phase)Max. 5.0kVA
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Air Consumption
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0.5 ~ 0.7MPa(5 ~ 7kgf/cm2)
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Mass
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Approx. 1,655kg
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External
Dimension(mm)
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1,650(L) x 1,680(D) x 1,530(H)
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