Detailed Product Description
| Brands | Flason |
| Name | Lead-free solder paste |
| Alloy | Sn96.5Ag3Cu0.5 |
| Package | 500g/bottle |
| Melting point | 138℃ |
| Particles 3# | 25 - 45μm(custom made) |
| Particles 4# | 20 - 38μm(custom made) |
| Working environment | 25±5℃ |
Contact Details
Dongguan KingFei Technology Co.,Limited
Contact Person: Sandy
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